A powerful US delegation, spearheaded by Deputy Secretary Jacob Helberg, has landed in India for the India-AI Impact Summit, signaling a new chapter in transatlantic tech diplomacy. Scheduled for February 20-21, the event draws Helberg and White House OSTP Director Michael Kratsios to foster stronger economic bonds through cutting-edge AI cooperation.
Helberg’s agenda is packed: bilateral discussions with Indian counterparts and a major address emphasizing expanded US-India collaboration on emerging tech. He’ll spotlight the rollout of the US AI Exports Program’s next phase, a cornerstone of the AI Action Plan designed to supercharge innovation worldwide.
In a parallel move, the US is launching a $200 million competitive grant program to fast-track secure smartphone rollout in the Indo-Pacific. Dubbed the Edge AI Package, it invites proposals for advanced devices on reliable OS platforms, aiming to onboard the region’s next billion online users into a vibrant, open ecosystem.
This strategy leverages AI tools to ignite developer creativity and entrepreneurship, realizing the ambitious Pax Silica framework for a digitally thriving Indo-Pacific. Market-driven solutions here counter high-risk suppliers, curb potential pricing distortions, and build robust AI systems that prioritize trust and reliability.
At its heart, this is about digital resilience. The US is committed to helping allies construct infrastructures that are not just advanced, but also independent and impervious to geopolitical coercion, paving the way for equitable tech progress.