Prime Minister Narendra Modi virtually unveiled the cutting-edge HCL-Foxconn joint venture semiconductor plant in Uttar Pradesh, underscoring India’s ambitious push into the international chip market. The event, conducted from the YEIDA premises, signals a new era of semiconductor manufacturing prowess for the nation.
Christened India Chip Private Limited, this OSAT plant has been established with an investment surpassing ₹3,700 crore. It will focus on assembling and testing display driver chips used in everything from smartphones and laptops to automotive components and other gadgets.
‘Uttar Pradesh is swiftly positioning itself as a central node in India’s expanding semiconductor ecosystem,’ PM Modi remarked. He highlighted the critical role of domestic chip production in powering key industries such as electronics and digital innovation.
The facility anticipates processing 20,000 wafers monthly upon commissioning, which will curtail import reliance and bolster local supply networks. Beyond job creation—spanning thousands of opportunities for skilled professionals—the plant is set to spur growth in supporting sectors, including startups and design hubs.
Its proximity to Jewar Airport promises superior logistics infrastructure, enhancing export capabilities. Drawing parallels to the successful India AI Impact Summit, PM Modi described the week’s developments as a transformative chapter, propelling India forward in global tech arenas as 2026 dawns brightly.